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Thermal engineer / Thinker / Builder

Anagh Dave.

Making sense of heat.
Building better cooling.

I'm a thermal engineer exploring how we keep electronics cool — from cold plates and thermal interfaces to the systems that bring them together.

  • Electronics cooling
  • Heat transfer
  • Thermal materials
Inside the coolant loop

01 / Publications & research

Exploring better ways to cool.

Microchannel design, passive mixing, and phase-change slurries for electronics cooling.

Journal article / 2026

Design of Herringbone Microchannels for Enhanced Mixing in Augmented Cooling Slurries

Anagh Dave, Vivek V. Manepalli, Roshith Mittakolu, Clayton Pullins, Michael T. Barako, Samuel Graham, and Damena Agonafer

IEEE Transactions on Components, Packaging and Manufacturing Technology ·

How can microchannel geometry help a microencapsulated phase-change material (MEPCM) slurry use more of its latent heat? This numerical study explores herringbone ribs that generate secondary vortices, improve transverse mixing, and promote particle melting. Regression-based heat-transfer and friction correlations support multi-objective optimization with NSGA-II, balancing cooling enhancement against pressure drop.

  • Microchannel cooling
  • MEPCM slurries
  • NSGA-II optimization
View publication on IEEE Read the illustrated research article
Herringbone microchannel research figure showing the channel array and rib geometry, simulated flow trajectories, and a cross-sectional enthalpy map with flow vectors under sidewall and bottom heating
Geometry and simulated flow. (a) Channel array and herringbone-rib geometry; (b) flow trajectories through the ribbed channel; (c) cross-sectional enthalpy distribution and flow vectors with heat entering through the sidewalls and bottom. Numerical visualization, not experimental imaging.
Open full-size figure

02 / Selected work

Ideas, made tangible.

Interactive exploration and technical writing from my Cooling Lab.

Illustration of airflow through a finned heat sink and cooling fan

Technical writing

Air cooling and liquid cooling

Two separate guides: heat sinks transfer heat to air; cold plates transfer heat to liquid coolant. Explore the design tradeoffs and interfaces behind each approach.

Heat sinks Cold plates

03 / Notes from the lab

Cooling Lab.

No such thing as too hot to handle.

A home for my curiosity about thermal engineering. Explore the components, materials, and ideas behind electronics cooling.

Start with the thermal stack

04 / Let's connect

Have a cooling challenge?
Let's talk engineering.

For engineering opportunities, collaboration, or a conversation about thermal design.